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Year

Fabrication and characterization of IC compatible through-wafer polysilicon interconnects

Peer-reviewed
Luusua, Ismo; Henttinen, Kimmo; Pekko, Panu; Vehmas, Tapani
ECS Transactions2007

Fully tileable photodiode matrix for medical imaging by using through-wafer interconnects

Peer-reviewed
DOI
10.1016/j.nima.2007.06.055
Juntunen, Mikko; Ji, Fan; Henttinen, Kimmo; Luusua, Ismo; Hietanen, Iiro; Eränen, Simo
Nuclear Instruments and Methods in Physics Research. Section A: Accelerators, Spectrometers, Detecto...2007

Through-wafer polysilicon interconnect fabrication with in-situ boron doping

Peer-reviewed
DOI
10.1557/PROC-872-J5.5
Luusua, Ismo; Henttinen, Kimmo; Pekko, Panu; Vehmas, Tapani; Luoto, Hannu
MRS Online Proceedings2005

Upside down T-shape through-wafer interconnects for fully tileable photodiode matrix for medical CT imaging

Peer-reviewed
DOI
10.1016/j.sna.2012.06.025
Juntunen, Mikko; Ji, Fan; Hietanen, Iiro; Eränen, Simo
Sensors and Actuators A: Physical2012

Fabrication of silicon based through-wafer interconnects for advanced chip scale packaging

Peer-reviewed
DOI
10.1016/j.sna.2007.02.030
Ji, Fan; Leppävuori, Seppo; Luusua, Ismo; Henttinen, Kimmo; Eränen, Simo; Hietanen, Iiro; Juntunen, ...
Sensors and Actuators A: Physical2008

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

Peer-reviewed
DOI
10.1109/ECTC.2013.6575770
Zoschke, K.; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, James; He...
Electronic Components and Technology Conference (ECTC)2013

Wafer scale packaging of MEMS by using plasma activated wafer bonding

Peer-reviewed
Suni, Tommi; Henttinen, Kimmo; Lipsanen, Antti; Dekker, James; Luoto, Hannu; Kulawski, Martin
ECS Proceedings Volumes2005

Conformance testing framework for service oriented interconnection technologies

Peer-reviewed
Open access
Keränen, Janne S.; Räty, Tomi; Jurmu, Petri; Mäki, Matti; Puolitaival, Olli-Pekka
International Journal of E-Business Development2013

Solderless Interconnection and Packaging Technique for Embedded Active Components

Peer-reviewed
Kujala, A.; Tuominen, R.; Kivilahti, J.
-1999

Etching through silicon wafer in inductively coupled plasma

Peer-reviewed
Franssila, S.; Kiihamäki, J.; Karttunen, J.
MICROSYSTEM TECHNOLOGIES: MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS2000

Fabrication and characterization of IC compatible through-wafer polysilicon interconnects

Peer-reviewed
2007

Fully tileable photodiode matrix for medical imaging by using through-wafer interconnects

Peer-reviewed
DOI
10.1016/j.nima.2007.06.055
2007

Through-wafer polysilicon interconnect fabrication with in-situ boron doping

Peer-reviewed
DOI
10.1557/PROC-872-J5.5
2005

Upside down T-shape through-wafer interconnects for fully tileable photodiode matrix for medical CT imaging

Peer-reviewed
DOI
10.1016/j.sna.2012.06.025
2012

Fabrication of silicon based through-wafer interconnects for advanced chip scale packaging

Peer-reviewed
DOI
10.1016/j.sna.2007.02.030
2008

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

Peer-reviewed
DOI
10.1109/ECTC.2013.6575770
2013

Wafer scale packaging of MEMS by using plasma activated wafer bonding

Peer-reviewed
2005

Conformance testing framework for service oriented interconnection technologies

Peer-reviewed
Open access
2013

Solderless Interconnection and Packaging Technique for Embedded Active Components

Peer-reviewed
1999

Etching through silicon wafer in inductively coupled plasma

Peer-reviewed
2000